Thermal Grizzly Prosessor-kjøler

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

High-end thermal paste. Kryonaut thermal grease was created especially for the extremely demanding applications and the highest expectations of the overclocking community. Kryonaut is also highly recommended as a top product for critical cooling systems in the industrial environment.

• Designed for Overclocking
• Excellent thermal conductivity
• No curing
• Long-term durability
• No electrical conductivity!

Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus achieving remarkable heat transfer.
 

The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.

Flytende metall kjølepasta, sølvpasta, densitet: 6,29 g/cm³, driftstemperatur: -50 - 200° C, 1 gram

CPU contact sealing frame, rød/svart, svart

Termisk pasta, designet for Overclocking, 14,2 W/m*K termisk ledningsevne, ingen herding, 2 gram

Thermal pads deliver electrically non-conductive heat transfer with improved thermal conductivity, high compressibility and straightforward application.

The Minus Pad Advance series builds on the proven Minus Pad 8 and offers enhanced thermal conductivity and compressibility compared to the Basic pads, suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive material


• Improved thermal conductivity


• High compressibility for uneven surfaces


• Easy to use and cut to size


• Size: 120 x 20 mm · Thickness: 2.0 mm · Color: black


• Pack content: 4 pcs

Ideal for reliable thermal coupling across a range of electronic components where consistent heat transfer is needed.

Thermal putty that serves as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates for height differences from 0.2 to 3.0 mm.

TG Putty is easy to apply with the supplied spatulas or by hand (gloves recommended) and is available in Basic, Advance and Pro variants that differ by thermal conductivity.

• Electrically non-conductive alternative to conventional thermal pads


• Fills gaps from 0.2–3.0 mm for VRAM, VRM and SMD components


• Apply broadly with spatulas or shape into small pellets for precise placement


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Operating temperature range −40°C to +120°C


• Advance variant includes three spatulas for application

Designed for GPU modifications and cooler conversions, it adapts to varied factory pad thicknesses for tailored thermal contact.

Termomasse, lysegrå

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Thermal Grizzly Duronaut er en høytytende termisk pasta som er utviklet for utmerket varmeoverføring og langvarig stabilitet.

Viktige egenskaper:

• Ekstremt holdbar
• Høy varmeledningsevne
• Ikke-ledende og trygg for elektronikk

Pakken inkluderer:

• 1x Duronaut termisk pasta 2g
• 1x applikator
• 1x TG Spatel
• 1x TG Spatel Pro

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

Thermal Grizzly TG Shield er en høytemperaturkonformal belegg for å beskytte komponenter mot kortslutninger med flytende metall. TG Shield tørker raskt for rask påføring og vil gi pålitelig beskyttelse av PC-komponenter i kombinasjon med flytende metall.

Termisk pute Thermal Grizzly Minus Pad extreme 2 leverer enestående varmeledningsevne og lav termisk grensesnittmotstand for høyytelsesapplikasjoner.

Thermal Grizzly Minus Pad extreme 2 er utviklet for å fylle selv de minste mellomrommene med varmeledende partikler takket være en sammensetning av aluminiumoksid, aluminiumhydroksid og aluminiumspulver, noe som fremmer optimal varmeoverføring mellom varmekilde og kjøler.

• Høyytelses termisk pute for ekstreme bruksområder
• Optimalisert materialsammensetning for lav termisk grensesnittmotstand
• Myk konsistens som tilpasser seg godt til kontaktflater
• Elektrisk ikke-ledende
• Herdner eller stivner ikke over tid, selv ved langvarig bruk

Pålitelig grensesnittmateriale for stabil og effektiv varmeoverføring i krevende bygg.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1x Duronaut thermal paste 6g
1x Applicator
1x TG Spatula
1x TG Spatula Pro
 

Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.

• very good thermal conductivity
• long-term durability
• no curing
• no electrical conductivity

Termopute, rødbrun

Thermal putty acts as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates height differences from 0.2 mm to 3.0 mm while remaining easy to apply.

The TG Putty line is available in three variants with differing thermal conductivity and is supplied with spatulas to enable straightforward, large-area application.

• Electrically non-conductive alternative to conventional thermal pads


• Compensates gaps from 0.2–3.0 mm


• Three variants: Basic (medium), Advance (good), Pro (excellent) thermal conductivity


• Includes three spatulas for application


• Operating temperature range −40°C to +120°C


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Apply only to clean, degreased surfaces (e.g., TG Cleaning Wipes or isopropanol)

Suited for replacing VRAM and VRM pads on single and larger graphics cards and for converting coolers to GPU water cooling setups.

Termopute, rødbrun

Thermal Grizzly TG Remove er en acetonebasert nano-renser for best mulig rengjøring av termisk pasta. I tillegg har TG Remove en avfettingsvirkning som hjelper med å forberede overflaten for ny påføring, f.eks. på CPUer.

Termopute, rødbrun

Termisk pad Thermal Grizzly Minus Pad extreme 2 leverer enestående varmeledningsevne med lav termisk grensesnittmotstand for høyytelsesapplikasjoner.

Thermal Grizzly Minus Pad extreme 2 er konstruert for å fylle selv de minste mellomrommene i matrisen ved å bruke en blanding av aluminiumoksid, aluminiumhydroksid og aluminiumspulver, noe som støtter optimal varmeoverføring mellom varmekilde og kjøler. Den myke konsistensen tilpasser seg godt til kontaktflater, er elektrisk ikke-ledende og herder eller stivner ikke over tid, selv ved langvarig bruk.

• Enestående varmeledningsevne
• Lav termisk grensesnittmotstand for optimal varmeoverføring
• Myk pad som tilpasser seg overflatene til varmekilde og kjøler
• Elektrisk ikke-ledende
• Herdner eller stivner ikke over tid

Pålitelig termisk grensesnittmateriale for stabil ytelse i krevende kjøleoppsett.

CPU contact frame for LGA 1851 (Intel 200 series). Can help improve cooling performance with better contact between CPU and cooler.

 Included in the package:

• 1x Intel 1851 CPU Contact Frame V1
• 4x Cylinder head screws with 3/8" UNC threads
• 1x 5/64" hex key
• 1x Torx T20 key

Grease spatula (en pakke 3)