Thermal Grizzly Prosessor-kjøler

The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1x Duronaut thermal paste 6g
1x Applicator
1x TG Spatula
1x TG Spatula Pro
 

Thermal putty that serves as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates for height differences from 0.2 to 3.0 mm.

TG Putty is easy to apply with the supplied spatulas or by hand (gloves recommended) and is available in Basic, Advance and Pro variants that differ by thermal conductivity.

• Electrically non-conductive alternative to conventional thermal pads


• Fills gaps from 0.2–3.0 mm for VRAM, VRM and SMD components


• Apply broadly with spatulas or shape into small pellets for precise placement


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Operating temperature range −40°C to +120°C


• Advance variant includes three spatulas for application

Designed for GPU modifications and cooler conversions, it adapts to varied factory pad thicknesses for tailored thermal contact.

Termisk pasta, designet for Overclocking, 14,2 W/m*K termisk ledningsevne, ingen herding, 2 gram

Thermal Grizzly Duronaut er en høytytende termisk pasta som er utviklet for utmerket varmeoverføring og langvarig stabilitet.

Viktige egenskaper:

• Ekstremt holdbar
• Høy varmeledningsevne
• Ikke-ledende og trygg for elektronikk

Pakken inkluderer:

• 1x Duronaut termisk pasta 2g
• 1x applikator
• 1x TG Spatel
• 1x TG Spatel Pro

Flytende metall kjølepasta, sølvpasta, densitet: 6,29 g/cm³, driftstemperatur: -50 - 200° C, 1 gram

Termisk pute leverer svært høy komprimerbarhet med utmerket varmeledningsevne, utviklet for å bygge bro over varierende høydeforskjeller på tvers av flere kontaktpunkter.

TG Minus Pad High Compression er spesielt praktisk for modifisering av grafikkort med en GPU-vannkjøler eller ved utskifting av termiske puter i en GPU-kjøler, siden én pute kan brukes for komponenter som VRAM, spenningsregulatorer og andre kontaktflater i samme oppsett – selv når nøyaktig nødvendig tykkelse er ukjent.

• Opprettholder varmeledningsevnen under kraftig kompresjon, og kan til og med øke ved høyere kontakttrykk
• Tilpasser seg godt til høydetoleranser
• Elektrisk ikke-ledende
• Svært allsidig og enkel å håndtere

Bidrar til å sikre jevn kontakt og effektiv varmeoverføring på tvers av blandede komponenthøyder.

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

Termomasse, lysegrå

Thermal putty acts as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates height differences from 0.2 mm to 3.0 mm while remaining easy to apply.

The TG Putty line is available in three variants with differing thermal conductivity and is supplied with spatulas to enable straightforward, large-area application.

• Electrically non-conductive alternative to conventional thermal pads


• Compensates gaps from 0.2–3.0 mm


• Three variants: Basic (medium), Advance (good), Pro (excellent) thermal conductivity


• Includes three spatulas for application


• Operating temperature range −40°C to +120°C


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Apply only to clean, degreased surfaces (e.g., TG Cleaning Wipes or isopropanol)

Suited for replacing VRAM and VRM pads on single and larger graphics cards and for converting coolers to GPU water cooling setups.

CPU-kontaktramme for Intel 13th gen Intel Raptor Lake og 14th gen Intel Raptor Lake-S, kan bidra til å forbedre kjøleytelsen med bedre kontakt mellom CPU og kjøler - vennligst se installasjonsvideo før du installerer

With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist is expanding its product range with advanced thermal pads. Based on their predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore ideal for use with memory chips or voltage converters. It is based on a silicone-based carrier complex and aluminum oxide as a heat transfer medium, thus achieving thermal conductivity similar to thermal paste.

The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and thermal conductivity is barely affected by the thickness, the choice of thickness should simply be tailored to the distance to be bridged.

Termomasse, lysegrå

Thermal pads deliver electrically non-conductive heat transfer with improved thermal conductivity, high compressibility and straightforward application.

The Minus Pad Advance series builds on the proven Minus Pad 8 and offers enhanced thermal conductivity and compressibility compared to the Basic pads, suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive material


• Improved thermal conductivity


• High compressibility for uneven surfaces


• Easy to use and cut to size


• Size: 120 x 20 mm · Thickness: 2.0 mm · Color: black


• Pack content: 4 pcs

Ideal for reliable thermal coupling across a range of electronic components where consistent heat transfer is needed.

Flytende metalltermisk pastaapplikator (pakke med 3)

Termisk pute leverer eksepsjonelt høy komprimerbarhet med utmerket varmeledningsevne, utviklet for å tilpasse seg varierende høydeforskjeller mellom komponenter.

TG Minus Pad High Compression er spesielt praktisk for modifisering av grafikkort med en GPU-vannkjøler eller ved utskifting av GPU-kjølerputer, slik at én pute kan bygge bro over flere toleranser på VRAM, spenningsregulatorer og andre kontaktflater i samme oppsett.

• Opprettholder varmeledningsevnen under kraftig kompresjon og kan øke ved høyere kontakttrykk
• Tilpasser seg godt til høydetoleranser når nøyaktig putetykkelse er ukjent
• Elektrisk ikke-ledende
• Enkel å håndtere og svært allsidig i bruk

Gir pålitelig kontakt på tvers av ujevne overflater for mer konsistent varmeoverføring i krevende bygg.

Termiske puter leverer høy varmeledningsevne med en svært elastisk, fleksibel overflate utviklet for å kompensere selv for de minste mellomrommene mellom komponenter.

Thermal Grizzly Minus Pad 8 er enkel å bearbeide og feste med lett trykk, og bruker en keramisk silikonformel-kompleks og nano aluminiumoksid for å støtte konstant, optimal varmeoverføring i et bredt utvalg av størrelser og tykkelser.

• Høy varmeledningsevne
• Høy komprimerbarhet
• Elektrisk isolasjon
• RoHS-kompatibel

Pålitelig kontakt og effektiv varmeoverføring bidrar til å holde følsomme komponenter termisk tilkoblet og stabile.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Termisk pasta, designet for Overclocking, 14,2 W/m*K termisk ledningsevne, ingen herding, 33.84 gram

CPU contact frame for LGA 1851 (Intel 200 series). Can help improve cooling performance with better contact between CPU and cooler.

 Included in the package:

• 1x Intel 1851 CPU Contact Frame V1
• 4x Cylinder head screws with 3/8" UNC threads
• 1x 5/64" hex key
• 1x Torx T20 key

Termomasse, lysegrå

Masse for prosessorvaremeavleder, sølv

Termisk pute Thermal Grizzly Minus Pad 8 er et rosa 2-paknings kjøletilbehør med 8 W/m-K varmeledningsevne for GPU, M.2 SSD og VRM-varmeavledning.

Den er utviklet for å bygge bro over mellomrom mellom varmeproduserende elektroniske komponenter og kjøleribber eller kjøleflater, ved bruk av et keramisk-silikon-kompleks med nano-aluminiumoksid.

• Elektrisk ikke-ledende materiale
• Egnet for GPU-kjøleribber, M.2 SSD-kjøleribber og VRM-kjøling
• Driftstemperaturområde fra -100 °C til +250 °C
• RoHS-kompatibelt design

Pålitelig støtte for varmeoverføring hjelper kjøleoppsettet ditt å fungere effektivt der komponenter og kjøleribber trenger god kontakt.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity
• High compressibility
• Easy to use
• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
• Minus Pad Advance: Improved thermal conductivity, higher compressibility.
• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

High-end thermal paste. Kryonaut thermal grease was created especially for the extremely demanding applications and the highest expectations of the overclocking community. Kryonaut is also highly recommended as a top product for critical cooling systems in the industrial environment.

• Designed for Overclocking
• Excellent thermal conductivity
• No curing
• Long-term durability
• No electrical conductivity!

Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus achieving remarkable heat transfer.