Thermal Grizzly Prosessor-kjøler - side 3

Water cooler optimized for Intel LGA1851 direct-die mounting with a nickel-plated copper microfin cold plate, low-flow-resistance jet channels and integrated RGB lighting.

The Intel 1851 Mycro Direct-Die Pro RGB V1 is designed to sit directly on a delidded Intel CPU to send heat straight into the water loop, with an acrylic-and-aluminum cover and controllable ARGB illumination.

• Direct-die installation for LGA1851 CPUs — requires removal of the ILM and CPU heatspreader; delidding is at your own risk


• Nickel-plated copper cold plate with microfins and a jet system, engineered for low flow resistance


• Acrylic layer tempered after milling to prevent stress cracks beneath the anodized aluminum lid


• Digital aRGB LEDs under the lid, controllable via a 3-pin ARGB header (+5V/DATA/GND); LEDs also illuminate the G1/4 fittings


• G1/4-inch female threading for standard fittings


• Tested with KryoSheet and thermal pads — additional pad thickness affected contact pressure and showed no significant temperature improvements

Built for users who want a compact direct cooling path from the CPU die into a water loop while retaining customizable RGB lighting.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Termopute, svart (en pakke 4)

The Intel 1851 Delid-Die-Mate V1 is a tool for removing the heat spreader (delidding) from Intel processors in the "Intel Core Ultra 200" series (LGA1851 socket). By removing the Integrated Heat Spreader (IHS), CPUs can be cooled using the "Direct-Die" method, where the cooler is mounted directly onto the processor chip. This enables the most efficient transfer of thermal dissipation power (TDP), or simply put, the heat, from the processor to the cooling loop.

 

Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacturer's warranty! Damage caused during delidding is not covered by the manufacturer! CPU should be heated. 

Flytende metalltermisk pastaapplikator (pakke med 3)

Thermal pads offer improved thermal conductivity, high compressibility and electrical insulation for reliable heat transfer on SSDs, GPU coolers and other electronic components.

The Minus Pad Advance series refines the proven Minus Pad 8 formula with enhanced thermal performance and easier handling, making it suitable for SSDs, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive for safe component contact


• Excellent thermal conductivity to aid heat dissipation


• High compressibility for better surface conformity


• Easy to use on a variety of cooling applications

Designed to improve heat transfer in compact cooling setups while remaining simple to apply.

Termomasse, grå, 10ml / 26g

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Carbonaut-pad er en karbonfiber termisk pad, brukt istedenfor termisk pasta, termisk ledningsevne: 62.5 W / (mK), størrelse: 38x38 og kompatibel med Intel LGA20xx socket & AMD AM4 socket

Termisk pute leverer eksepsjonelt høy komprimerbarhet med utmerket varmeledningsevne, utviklet for å tilpasse seg varierende høydeforskjeller mellom komponenter.

TG Minus Pad High Compression er spesielt praktisk for modifisering av grafikkort med en GPU-vannkjøler eller ved utskifting av GPU-kjølerputer, slik at én pute kan bygge bro over flere toleranser på VRAM, spenningsregulatorer og andre kontaktflater i samme oppsett.

• Opprettholder varmeledningsevnen under kraftig kompresjon og kan øke ved høyere kontakttrykk
• Tilpasser seg godt til høydetoleranser når nøyaktig putetykkelse er ukjent
• Elektrisk ikke-ledende
• Enkel å håndtere og svært allsidig i bruk

Gir pålitelig kontakt på tvers av ujevne overflater for mer konsistent varmeoverføring i krevende bygg.

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• Outstanding compressibility


• Easy to use


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Color: gray

Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity


• Easy to use


• Consistently high performance


• Extreme durability
  
  

Attention: Electrically conductive! Follow instructions!

Termomasse, grå

Termiske puter leverer høy varmeledningsevne med en svært elastisk, fleksibel overflate utviklet for å kompensere selv for de minste mellomrommene mellom komponenter.

Thermal Grizzly Minus Pad 8 er enkel å bearbeide og feste med lett trykk, og bruker en keramisk silikonformel-kompleks og nano aluminiumoksid for å støtte konstant, optimal varmeoverføring i et bredt utvalg av størrelser og tykkelser.

• Høy varmeledningsevne
• Høy komprimerbarhet
• Elektrisk isolasjon
• RoHS-kompatibel

Pålitelig kontakt og effektiv varmeoverføring bidrar til å holde følsomme komponenter termisk tilkoblet og stabile.

Kapton Insulation Sheet is a polyamide film that can be used at high temperatures up to 280 degrees Celsius and acts as an assembly aid for electrically conductive thermal interface material (TIM). It is ideal for covering components such as SMDs on a CPU or GPU if they are to be used with Conductonaut liquid metal, Carbonaut or KryoSheet.

Brief Informations:

• 50 adhesive strips 10x60mm
• Thickness of 40µm
• Electrically insulating
• Max Temp: 280°C
• Breakdown voltage: Over 1 kV
• Clean the adhesive surface beforehand!

Scope of delivery

• 10x carrier foil with  5 Kapton Insulation Sheets each
   

Thermal pads offer extremely high thermal conductivity, outstanding compressibility, electrical insulation, and straightforward installation for efficient component cooling.

The Minus Pad Pro is the Pro-series thermal pad refined from the Minus Pad 8 to deliver improved thermal conductivity and compressibility for SSDs, GPU coolers, water blocks and electronic components.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive


• Easy to apply


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed to enhance heat transfer between components and cooling solutions in compact assemblies.

With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist is expanding its product range with advanced thermal pads. Based on their predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore ideal for use with memory chips or voltage converters. It is based on a silicone-based carrier complex and aluminum oxide as a heat transfer medium, thus achieving thermal conductivity similar to thermal paste.

The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and thermal conductivity is barely affected by the thickness, the choice of thickness should simply be tailored to the distance to be bridged.

Termiske puter fra TG Minus Pad High Compression-serien kombinerer eksepsjonelt høy komprimerbarhet med utmerket varmeledningsevne, selv under kraftig kompresjon.

Utviklet for å bygge bro over varierende høydeforskjeller. Disse putene er spesielt nyttige ved modifisering av grafikkort med en GPU-vannkjøler eller ved utskifting av de termiske putene i en GPU-kjøler, og bidrar til å opprettholde pålitelig kontakt på tvers av flere komponenter i samme oppsett.

• Tilpasser seg godt til høydetoleranser
• Elektrisk ikke-ledende
• Svært allsidig i bruk
• Enkel å håndtere

Ideell når nøyaktig nødvendig putetykkelse er ukjent, med varmeledningsevne som til og med kan øke ved høyere kontakttrykk.

Termisk pute Thermal Grizzly Minus Pad extreme 2 leverer enestående varmeledningsevne med lav termisk grensesnittmotstand for høyytelses kjøleapplikasjoner.

Thermal Grizzly Minus Pad extreme 2 er utviklet for å fylle selv de minste mellomrommene takket være en partikkelblanding av aluminiumoksid, aluminiumhydroksid og aluminiumspulver, og bidrar til å fremme optimal varmeoverføring mellom varmekilde og kjøler. Den myke konsistensen tilpasser seg godt til overflater, samtidig som puten er elektrisk ikke-ledende og ikke herder eller stivner over tid.

• Enestående varmeledningsevne
• Lav termisk grensesnittmotstand
• Fyller små mellomrom med varmeledende partikler
• Myk pute som tilpasser seg overflatene til varmekilde og kjøler
• Elektrisk ikke-ledende
• Herdner eller stivner ikke over tid

Pålitelig termisk grensesnittmateriale for å opprettholde effektiv varmeoverføring i krevende bygg.

GPU-vannblokk for Asus ROG Astral GeForce RTX 5090 har en ultrahøyytelses coldplate, målrettet VRAM- og VRM-kjøling, og et svart anodisert aluminiumshus med RGB-belysning.

DeltaMate GPU Block bruker et dobbelt cold plate-design med nikkelbelagte kobberkontaktflater som er CNC-maskinert for effektiv varmeoverføring.

• Ultrahøyytelses microfin-coldplate
• Helmetallkonstruksjon med belyst visningsvindu
• Direkte messingterminal med én innløp og én utløp
• Inkluderer Thermal Grizzly termisk pasta og termiske puter

Den medfølgende “The Oracle” spacer PCB hjelper med å kontrollere passform og planlegge en tilpasset væskekjølingssløyfe før installasjon.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity
• High compressibility
• Easy to use
• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
• Minus Pad Advance: Improved thermal conductivity, higher compressibility.
• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Termisk pad Thermal Grizzly Minus Pad extreme 2 leverer enestående varmeledningsevne og lav termisk grensesnittmotstand for høyytelsesapplikasjoner.

Thermal Grizzly Minus Pad extreme 2 er utformet for å fylle selv de minste mellomrommene med varmeledende partikler takket være en sammensetning av aluminiumoksid, aluminiumhydroksid og aluminiumspulver, noe som fremmer optimal varmeoverføring mellom varmekilde og kjøler.

• Optimalisert materialsammensetning for lav termisk grensesnittmotstand
• Myk konsistens som tilpasser seg godt til kontaktflater
• Elektrisk ikke-ledende
• Herdner eller stivner ikke over tid, selv ved langvarig bruk

Pålitelig termisk grensesnitt-ytelse for krevende kjøleoppsett.

Termopute, rødbrun

Thermal pad delivering excellent thermal conductivity and outstanding compressibility for efficient heat transfer in SSDs, GPU coolers and other electronic components.

The Minus Pad Pro is an electrically non-conductive thermal pad developed to improve thermal conductivity and compressibility while remaining easy to apply.

• Excellent thermal conductivity


• Outstanding compressibility for reliable contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Easy-to-use design ensures consistent thermal contact across a range of cooling and electronic applications.

Termisk pasta Thermal Grizzly Duronaut Pro tilbyr utmerket varmeledningsevne, ekstrem langtidsstabilitet, elektrisk ikke-ledende bruk og uten herding over tid.

Duronaut Pro er en high-end termisk pasta utviklet for gamere, overklokkere og krevende industrielle kjølesystemer, med silikonolje med aluminiummikropulver og sinkoksidnanopulver.

• Minimerer pump-out-effekten med optimalisert partikkelform og -størrelse
• Støtter tynne påføringslag for lav termisk kontaktmotstand
• Inkluderer applikator, TG Spatula og TG Spatula Pro
• Innhold: 2 g

Utviklet for effektiv varmeoverføring mellom varmekilde og kjøler, bidrar Duronaut Pro til å opprettholde pålitelig kjøleytelse over tid.