Thermal Grizzly Prosessor-kjøler - side 2

Termomasse, lysegrå

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

CPU-kontaktramme for Intel 13th gen Intel Raptor Lake og 14th gen Intel Raptor Lake-S, kan bidra til å forbedre kjøleytelsen med bedre kontakt mellom CPU og kjøler - vennligst se installasjonsvideo før du installerer

Termopute, rødbrun

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

CPU Contact Frame improves cooling by shifting contact pressure to the edges, preventing IHS concavity and enabling better cooler contact on Intel LGA1700 sockets.

The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the injection-molded "Lite" mounting frame made from ABS reinforced with 15% glass fiber that replaces the standard ILM to increase contact surface and simplify installation.

• Injection-molded ABS with 15% glass fiber for added stability


• Inner contour shifts pressure from centre to edges to avoid concave IHS


• Designed for Intel LGA1700; compatible with 12th, 13th and 14th Gen CPUs


• Only for CPUs whose IHS has been ground down by no more than 0.2 mm


• Includes 4 pan-head screws (UNC 3/8"), 5/64" hex socket wrench and Torx T20 angle wrench

Simple installation and improved cooler contact can lead to noticeably lower CPU temperatures depending on the cooler and processor.

Termisk pasta, designet for Overclocking, 14,2 W/m*K termisk ledningsevne, ingen herding, 33.84 gram

Termopute, rødbrun (en pakke 2 )

Spatelsett TG Spatula Pro (3-pakning) sikrer jevn og presis påføring av termisk pasta på CPU-er, optimalisert for å gi mulighet for mer trykk under utstrykingen.

Utformet for nøyaktig, jevn påføring av termiske pastaer med høy til svært høy viskositet. Disse myke plastspatlene reduserer risikoen for riper eller overflateskader og reagerer ikke med metalliske komponenter i termiske pastaer.

• Praktisk 3-pakning
• Myk plast med lavere hardhet enn metallverktøy
• Murskje-lignende form for høy stivhet ved trykk nedover
• Kompatibel med Thermal Grizzly Duronaut, Aeronaut, Hydronaut, Kryonaut og Kryonaut Extreme

Bidrar til en ren, jevn fordeling for pålitelige resultater med termisk pasta.

Termopute, rødbrun (en pakke 2 )

Masse for prosessorvaremeavleder, sølv

AM5 High Performance Heatspreader er en oppgradering for AMDs Ryzen 7000 CPUer. Varmespreders presisjons diamantfreste nikkelbelagte kobberoverflate gir 240 % mer overflateareal. Som et resultat tillater AM5-varmesprederen maksimal varmeavledning med luft- og vannkjølere.

The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink.

The Intel High Performance Heatspreader V1 is compatible with the following processors:

Intel 12th Gen CPUs
Intel 13th Gen CPUs
Intel 14th Gen CPUs (200s)

Scope of delivery

1x Intel High Performance Heatspreader V1
4x pan-head screws UNC thread 3/8"
1x hexagon socket wrench 5/64"
1x angle wrench Torx T20
 

Termisk pute leverer høy kompresjon, svært høy komprimerbarhet og varmeledningsevne i en elektrisk ikke-ledende utforming for enkel installasjon.

Thermal Grizzly Minus Pad High Compression er utviklet for PC-entusiaster og moddere som trenger en fleksibel pute som pålitelig kompenserer for varierende komponenthøyder uten kompliserte målinger, og som kan kuttes til størrelse for et bredt spekter av bygg.

• Høy komprimerbarhet bidrar til å kompensere for høydeforskjeller når den nøyaktige spalten er ukjent
• Utmerket varmeledningsevne støtter effektiv varmeutveksling
• Elektrisk ikke-ledende for å bidra til å forhindre kortslutning i følsom elektronikk
• Allsidig bruk for SSD-er, bærbare PC-er, VRM-er og grafikkort

Ideell for praktiske kjøleoppgraderinger der toleranse, sikkerhet og enkel håndtering er viktig.

Thermal pads with improved thermal conductivity, high compressibility and electrical insulation for effective heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Advance pads are easy to use and were developed from the Minus Pad 8 to deliver improved thermal conductivity and higher compressibility.

• Excellent thermal conductivity


• High compressibility for better surface contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Improved price-performance ratio

Designed to provide reliable heat transfer and gap filling across a range of PC and electronic cooling applications.

CPU-monteringsramme muliggjør direkte-die-montering for AMD Ryzen 7000-prosessorer på AM5 ved å utelate den integrerte varmesprederen for betydelig lavere driftstemperaturer.

Thermal Grizzly Ryzen 7000 Direct Die Frame lar CPU-kjøleren din komme i direkte kontakt med prosessorens chiplets for mer effektiv varmeavledning, samtidig som den bidrar til å beskytte eksponerte chiplets mot kontakttrykk som kan svekke CPU-funksjonen.

• Kompatibel med AMD Ryzen 7000 (inkl. Ryzen 7000 V2)
• Muliggjør montering av deliddede Ryzen-CPU-er
• Enkel montering
• Anodisert aluminiumskonstruksjon i svart

Ideell for ekstreme overklokkere, gamere og innholdsskapere som ønsker forbedret kjøling gjennom direkte varmeoverføring.

Termisk pute tilbyr eksepsjonelt høy komprimerbarhet med utmerket varmeledningsevne, utviklet for å bygge bro over varierende høydeforskjeller på tvers av flere kontaktpunkter.

TG Minus Pad High Compression er spesielt praktisk ved modifisering av grafikkort med en GPU-vannkjøler eller ved utskifting av termiske puter på en GPU-kjøler, slik at én putetype kan dekke komponenter som VRAM, spenningsregulatorer og andre kontaktflater i samme oppsett.

• Svært høy komprimerbarhet
• Utmerket varmeledningsevne, selv under kraftig kompresjon
• Tilpasser seg godt til høydetoleranser
• Elektrisk ikke-ledende
• Enkel å håndtere

Ideell når nøyaktig putetykkelse er usikker, og bidrar til å opprettholde pålitelig kontakt samtidig som toleranser kompenseres.

Termopute, rødbrun

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity
• High compressibility
• Easy to use
• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
• Minus Pad Advance: Improved thermal conductivity, higher compressibility.
• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermal pads provide improved thermal conductivity and high compressibility for efficient heat transfer in SSDs, GPU coolers, water coolers and other electronic components.

The electrically non-conductive Minus Pad Advance builds on the proven Minus Pad 8 design and was developed to improve thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• High compressibility for uneven surfaces


• Easy to apply and handle


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed for straightforward installation, these pads help maintain effective thermal contact across a range of PC and electronics cooling applications.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

The 12th Gen Lapping-Tool is specially designed for the Intel 12th Gen Contact Frame and simplifies the process of lapping the processor. Using the enclosed screws, the CPU is simply mounted on the Lapping-Tool with the Contact Frame. This simulates the actual final position of the CPU in the socket on the motherboard.

The Intel 1851 Delid-Die-Mate Heater V1 is a specially designed heating element for the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of both the CPU and the delidder to 165°C, the necessary temperature for delidding. The operation is controlled via a control unit with an OLED display, which is connected to the heater with two cables. A laptop/smartphone charger with at least 65 watts of power and a USB Type-C connector, which is not included, is required for the heater to operate. A small amount of thermal paste is also needed.

Heating element for warming the CPU
Designed for the Intel 1851 Delid-Die-Mate V1
Follow the warning instructions!
Scope of Delivery:

1x Intel 1851 Delid-Die-Mate Heater V1
1x Angle wrench
1x TG Cleaning Wipes
1x Kryonaut, 1g
Warning Instructions:

Note: When delidding with the Intel 1851 Delid-Die-Mate V1, the CPU should be heated to 165°C (the melting point of indium is 157°C) to liquefy the indium, making it easier to remove the heat spreader. This minimizes mechanical stress on the chip and helps prevent damage. Otherwise, there is a high risk that the CPU could be damaged during delidding.

Caution: delidding a CPU can be dangerous. Any damaged caused by this will not be covered by warranty. Make sure to ressearch how to before trying. 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended