Thermal Grizzly Prosessor-kjøler - side 4

Thermal Grizzly Minus Pad Pro - 120x20x1.0 mm 2 pc - Termisk plate

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

Thermal Grizzly Aeronaut - thermal paste (10ml - 26g) - Kjølepasta

Thermal Grizzly Minus Pad Extreme - 100 X 100 X 2 mm - Termisk plate

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme - 100 X 100 X 1 mm - Termisk plate

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad 8 - Termisk plate

Thermal Grizzly Minus Pad Basic - 120x20x2.0 mm 4 pcs - Termisk plate

Thermal Grizzly Polartherm X-8 - 10g - Kjølepasta

Termisk pasta X-8 kombinerer et silikonoljebasert bæremedium med aluminium- og sinkoksidpulver for å forbedre termisk ytelse ved CPU- og GPU-kjøling i luft- eller væskekjølesystemer.

Utviklet for hverdagsbrukere, gamere og DIY-PC-byggere: X-8 tilbyr svært god varmeledningsevne med god motstand for enkel påføring, samtidig som den gir holdbarhet som motvirker pump-out-effekten og bidrar til å holde systemer kjølige, stillegående og stabile under belastning.

• Silikonbasert, grå termisk masse
• Ikke elektrisk ledende
• Inkluderer applikator og spatel med flere påføringsmetoder
• Driftstemperatur: -50 til +150°

Pålitelig varmeoverføring og praktisk påføringsstøtte for jevn, stabil kjøleytelse.

Thermal Grizzly Polartherm X-8 - 5g

Termisk pasta Polartherm X-8 leverer høyytelses varmeavledning med en elektrisk ikke-ledende formel, 5 g kapasitet for 8–10 påføringer, og et medfølgende applikatorsett.

Utformet som en allsidig allrounder, bruker X-8 en blanding av silikon, aluminium og aluminiumoksid for å fylle selv små mellomrom og sikre jevn kjøling mellom CPU og kjøler, med lav viskositet for å trenge inn i mikroskopiske ujevnheter.

• Elektrisk ikke-ledende for ekstra beskyttelse og redusert risiko for kortslutninger
• Enkel påføring direkte eller med medfølgende applikatorer og spatel
• Ca. 8–10 påføringer fra én 5 g-pakke
• Driftstemperaturområde: -50 °C til 150 °C

Ideell for flere bygg og spesielt godt egnet for CPU-er med lavere varmeutvikling for pålitelig varmeoverføring.

Thermal Grizzly Minus Pad Basic - 120x20x3.0 mm 4 pcs - Termisk plate

Thermal Grizzly Minus Pad Advance - 120x20x1.0 mm - 4 pcs - Termisk plate

Thermal pads offer improved thermal conductivity, high compressibility and electrical insulation for reliable heat transfer on SSDs, GPU coolers and other electronic components.

The Minus Pad Advance series refines the proven Minus Pad 8 formula with enhanced thermal performance and easier handling, making it suitable for SSDs, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive for safe component contact


• Excellent thermal conductivity to aid heat dissipation


• High compressibility for better surface conformity


• Easy to use on a variety of cooling applications

Designed to improve heat transfer in compact cooling setups while remaining simple to apply.

Thermal Grizzly Lapping Tool for Ryzen 7000 - Modding

Thermal Grizzly Intel High Performance Heatspreade

The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink.

The Intel High Performance Heatspreader V1 is compatible with the following processors:

Intel 12th Gen CPUs
Intel 13th Gen CPUs
Intel 14th Gen CPUs (200s)

Scope of delivery

1x Intel High Performance Heatspreader V1
4x pan-head screws UNC thread 3/8"
1x hexagon socket wrench 5/64"
1x angle wrench Torx T20
 

Thermal Grizzly Polartherm X-10 - 10g

Termisk pasta Polartherm X-10 leverer høyytelses, elektrisk ikke-ledende varmeoverføring i en 10 g-pakke, inkludert et applikatorsett for enkel og jevn påføring.

Utformet som en allrounder for ulike bruksområder, bidrar blandingen av silikon, aluminium og aluminiumoksid til å avlede varme effektivt fra komponenter og fylle selv de minste mellomrommene for pålitelig kjøling, noe som gjør den spesielt egnet for CPU-er med høyere varmeutvikling.

• 10 g pasta for omtrent 18–20 påføringer
• Inkluderer applikatorer og spatel for presis spredning
• Høy viskositet for stabilitet under ekstreme forhold
• Elektrisk ikke-ledende for å redusere kortslutningsrisiko

Skaper et jevnt lag som forbedrer varmeoverføringen og bidrar til å holde krevende systemer kjøligere.

Thermal Grizzly Minus Pad 8 - 120×20×1mm - Termisk plate

Thermal Grizzly Intel 1851 Delid-Die-Mate Heater

The Intel 1851 Delid-Die-Mate Heater V1 is a specially designed heating element for the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of both the CPU and the delidder to 165°C, the necessary temperature for delidding. The operation is controlled via a control unit with an OLED display, which is connected to the heater with two cables. A laptop/smartphone charger with at least 65 watts of power and a USB Type-C connector, which is not included, is required for the heater to operate. A small amount of thermal paste is also needed.

Heating element for warming the CPU
Designed for the Intel 1851 Delid-Die-Mate V1
Follow the warning instructions!
Scope of Delivery:

1x Intel 1851 Delid-Die-Mate Heater V1
1x Angle wrench
1x TG Cleaning Wipes
1x Kryonaut, 1g
Warning Instructions:

Note: When delidding with the Intel 1851 Delid-Die-Mate V1, the CPU should be heated to 165°C (the melting point of indium is 157°C) to liquefy the indium, making it easier to remove the heat spreader. This minimizes mechanical stress on the chip and helps prevent damage. Otherwise, there is a high risk that the CPU could be damaged during delidding.

Caution: delidding a CPU can be dangerous. Any damaged caused by this will not be covered by warranty. Make sure to ressearch how to before trying. 

Thermal Grizzly Ryzen 7000 Direct Die Frame

Thermal Grizzly Minus Pad 8 - 30×30×1.5mm - Termisk plate

Thermal Grizzly Minus Pad Pro - 100x100x0.5 mm - Termisk plate

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermal Grizzly Minus Pad HC 120x100x3 mm 2 pcs

Termiske puter fra TG Minus Pad High Compression-serien kombinerer eksepsjonelt høy komprimerbarhet med utmerket varmeledningsevne, selv under kraftig kompresjon.

Utviklet for å bygge bro over varierende høydeforskjeller. Disse putene er spesielt nyttige ved modifisering av grafikkort med en GPU-vannkjøler eller ved utskifting av de termiske putene i en GPU-kjøler, og bidrar til å opprettholde pålitelig kontakt på tvers av flere komponenter i samme oppsett.

• Tilpasser seg godt til høydetoleranser
• Elektrisk ikke-ledende
• Svært allsidig i bruk
• Enkel å håndtere

Ideell når nøyaktig nødvendig putetykkelse er ukjent, med varmeledningsevne som til og med kan øke ved høyere kontakttrykk.

Thermal Grizzly Minus Pad Pro - 120x20x2.0 mm 2 pc - Termisk plate

Thermal pad delivering excellent thermal conductivity and outstanding compressibility while remaining electrically non-conductive and easy to apply.

The Minus Pad Pro is part of the Minus Pad series, developed from the proven Minus Pad 8 to boost thermal performance and compressibility for components such as SSDs, GPU coolers, GPU water-cooling setups, voltage regulators and memory modules.

• Excellent thermal conductivity for efficient heat transfer


• Outstanding compressibility for tight-gap filling


• Electrically non-conductive for safe use on electronics


• Easy to use and install


• Color: gray

Provides a reliable thermal interface between electronic components and cooling solutions to enhance heat dissipation in compact assemblies.

Thermal Grizzly Minus Pad Pro - 100x100x2.0 mm - Termisk plate

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• Outstanding compressibility


• Easy to use


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Color: gray

Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.

Thermal Grizzly Minus Pad Advance - 100x100x2.0 mm 2pcs - Termisk plate

With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist is expanding its product range with advanced thermal pads. Based on their predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore ideal for use with memory chips or voltage converters. It is based on a silicone-based carrier complex and aluminum oxide as a heat transfer medium, thus achieving thermal conductivity similar to thermal paste.

The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and thermal conductivity is barely affected by the thickness, the choice of thickness should simply be tailored to the distance to be bridged.

Thermal Grizzly Polartherm X-8 - 40g

Termisk pasta Polartherm X-8 kombinerer høyytelses varmeavledning med en elektrisk ikke-ledende blanding av silikon, aluminium og aluminiumoksid i en 40 g-pakke for effektiv varmeavledning.

Utformet som en allsidig allrounder for ulike bruksområder, trenger den lavviskøse formelen inn i mikroskopiske mellomrom for å forbedre varmeoverføring mellom komponenter og kjøler, og den kan påføres direkte eller med de medfølgende applikatorene og spatelen for jevn dekning.

• 40 g til omtrent 70–80 påføringer
• Elektrisk ikke-ledende for å redusere risikoen for kortslutninger
• Enkel påføring med medfølgende applikatorsett og spatel
• Driftstemperatur fra -50 °C til 150 °C

Bidrar til å fylle selv de minste mellomrommene for pålitelig, jevn kjøling, spesielt godt egnet for CPU-er med lavere varmeutvikling.

Thermal Grizzly Minus Pad Pro - 120x20x3.0 mm 2 pc - Termisk plate

Thermal pads offering extremely high thermal conductivity, outstanding compressibility and electrically non-conductive properties for use on SSDs, GPU coolers and electronic components.

The Minus Pad Pro combines excellent heat transfer with exceptional compressibility while remaining electrically non-conductive, making it suitable for cooling SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive for safe use on electronics


• Easy to use


• Designed for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Based on the proven Minus Pad 8 and developed to further improve thermal conductivity and compressibility for reliable component cooling.

Thermal Grizzly Intel 1851 Delid-Die-Mate V1

The Intel 1851 Delid-Die-Mate V1 is a tool for removing the heat spreader (delidding) from Intel processors in the "Intel Core Ultra 200" series (LGA1851 socket). By removing the Integrated Heat Spreader (IHS), CPUs can be cooled using the "Direct-Die" method, where the cooler is mounted directly onto the processor chip. This enables the most efficient transfer of thermal dissipation power (TDP), or simply put, the heat, from the processor to the cooling loop.

Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacturer's warranty! Damage caused during delidding is not covered by the manufacturer! CPU should be heated.